1 PRODUCT DESCRIPTION
The QSFP+ to SFP+ hybrid cable assembly solution is specially designed for high-speed applications to interconnect QSFP+ port to SFP+ port(s). QSFP+ to SFP+ hybrid cable assembly family consists of QSFP+ to 1SFP+, QSFP+ to 2SFP+ and QSFP+ to 4SFP+.
This QSFP+ to SFP+ hybrid cable assemblies is high performance; high bandwidth and cost effective interconnect solutions which support Ethernet and InfiniBand standards with different data rate applications.
The limits and specifications provided in this datasheet are informative only as there is no industrial specification governing QSFP+ to SFP+ hybrid cable assembly. The limits and specifications provided in this datasheet are subject to change.
2 REFERENCE INDUSTRY DOCUMENTS
The following documents, of the latest issues in effect at the time of performance of the qualification tests, are the reference documents for this datasheet.
Document Number | Title |
SFP Multi-Source Agreement | Physical Specifications of SFP |
SFF-8436 | Specification for QSFP+ 10 Gbs 4X Pluggable Transceiver |
SFF-8431 | Specification for Enhanced Small Form Factor Pluggable Module SFP+ |
EIA-364 | EIA Standard |
UL 94 | Tests for Flammability of Plastic Materials for Parts in Devices and Appliances. Underwriters Laboratories, Inc. |
EIA-364-1000.01 | Environmental Test Methodology for Assessing the Performance of Electrical Connectors and Sockets Used in Business Office Applications |
3 SPECIFICATIONS
3.1 Material
3.1.1 Backshell
Zinc alloy. Nickel plated over all 100u” Min.
3.1.2 PCB Contact Configuration
QSFP+ paddle card:
SFP+ paddle card:
3.1.3 PCB Contact Plating
100 u" min. nickel underplate over all
30 u” min. gold over nickel at contact area
3.1.4 Raw Cable
High Speed cable, 2 pairs, 100 +/- 5 ohms
3.2 Ratings
Item | Specification |
Voltage | 30VAC (rms) or DC |
Current | 0.5A/Contact |
Operating Temperature | -40℃ to 85 ℃ |
3.3 Electrical
Item | Specification |
Low Level Contact Resistance | Initial: Baseline Change : 20 milliohms maximum |
Insulation Resistance | 300VDC , 1000Mohm(Min.) |
Dielectric Withstanding Voltage | AC 350V 1min, no breakdown or flash |
3.4 Signal Integrity
Item | Specification |
Insertion Loss | Frequency SDD21(min) |
Return Loss |
<-12+2*SQRT(f); 1≤f<4.11 ; <-6.3+13log10(f/5.5); 4.11≤f≤10 ; where f in GHz. |
1 PRODUCT DESCRIPTION
The QSFP+ to SFP+ hybrid cable assembly solution is specially designed for high-speed applications to interconnect QSFP+ port to SFP+ port(s). QSFP+ to SFP+ hybrid cable assembly family consists of QSFP+ to 1SFP+, QSFP+ to 2SFP+ and QSFP+ to 4SFP+.
This QSFP+ to SFP+ hybrid cable assemblies is high performance; high bandwidth and cost effective interconnect solutions which support Ethernet and InfiniBand standards with different data rate applications.
The limits and specifications provided in this datasheet are informative only as there is no industrial specification governing QSFP+ to SFP+ hybrid cable assembly. The limits and specifications provided in this datasheet are subject to change.
2 REFERENCE INDUSTRY DOCUMENTS
The following documents, of the latest issues in effect at the time of performance of the qualification tests, are the reference documents for this datasheet.
Document Number | Title |
SFP Multi-Source Agreement | Physical Specifications of SFP |
SFF-8436 | Specification for QSFP+ 10 Gbs 4X Pluggable Transceiver |
SFF-8431 | Specification for Enhanced Small Form Factor Pluggable Module SFP+ |
EIA-364 | EIA Standard |
UL 94 | Tests for Flammability of Plastic Materials for Parts in Devices and Appliances. Underwriters Laboratories, Inc. |
EIA-364-1000.01 | Environmental Test Methodology for Assessing the Performance of Electrical Connectors and Sockets Used in Business Office Applications |
3 SPECIFICATIONS
3.1 Material
3.1.1 Backshell
Zinc alloy. Nickel plated over all 100u” Min.
3.1.2 PCB Contact Configuration
QSFP+ paddle card:
SFP+ paddle card:
3.1.3 PCB Contact Plating
100 u" min. nickel underplate over all
30 u” min. gold over nickel at contact area
3.1.4 Raw Cable
High Speed cable, 2 pairs, 100 +/- 5 ohms
3.2 Ratings
Item | Specification |
Voltage | 30VAC (rms) or DC |
Current | 0.5A/Contact |
Operating Temperature | -40℃ to 85 ℃ |
3.3 Electrical
Item | Specification |
Low Level Contact Resistance | Initial: Baseline Change : 20 milliohms maximum |
Insulation Resistance | 300VDC , 1000Mohm(Min.) |
Dielectric Withstanding Voltage | AC 350V 1min, no breakdown or flash |
3.4 Signal Integrity
Item | Specification |
Insertion Loss | Frequency SDD21(min) |
Return Loss |
<-12+2*SQRT(f); 1≤f<4.11 ; <-6.3+13log10(f/5.5); 4.11≤f≤10 ; where f in GHz. |